Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels ..."

David Cuesta et al. (2015)

> Home

Details and statistics

DOI: 10.1016/J.ASOC.2015.04.052

access: closed

type: Journal Article

metadata version: 2022-10-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/asc/CuestaRAH15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/asc/CuestaRAH15
David Cuesta, José L. Risco-Martín, José L. Ayala, José Ignacio Hidalgo:
Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization. Appl. Soft Comput. 34: 164-177 (2015)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.