"Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic ..."

Jinn-Tsong Tsai et al. (2016)

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DOI: 10.1109/ACCESS.2016.2581258

access: open

type: Journal Article

metadata version: 2018-07-04

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Jinn-Tsong Tsai, Cheng-Chung Chang, Wen-Ping Chen, Jyh-Horng Chou:
Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method. IEEE Access 4: 3034-3045 (2016)

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