"Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin ..."

Kaiyi Tian et al. (2021)

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DOI: 10.1109/ACCESS.2021.3058612

access: open

type: Journal Article

metadata version: 2021-03-23

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Kaiyi Tian, Senyuan Yang, Jiaxuan Niu, Hanxiang Wang:
Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin by Incorporation of Mesogens Without Nanofillers. IEEE Access 9: 31575-31580 (2021)

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