"Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost ..."

Serguei Stoukatch et al. (2022)

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DOI: 10.1109/ACCESS.2022.3151356

access: open

type: Journal Article

metadata version: 2022-04-01

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Serguei Stoukatch, Jean-François Fagnard, François Dupont, Philippe Laurent, Marc Debliquy, Jean-Michel Redouté:
Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors. IEEE Access 10: 19242-19253 (2022)

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