"Image-Based Accelerated Prediction of Thermal Properties of Package ..."

Jeong-Hyeon Park et al. (2025)

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DOI: 10.1109/ACCESS.2025.3580727

access: open

type: Journal Article

metadata version: 2025-08-05

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Jeong-Hyeon Park, Jaechoon Kim, Sukwon Jang, Sungho Mun, Eun-Ho Lee:
Image-Based Accelerated Prediction of Thermal Properties of Package Substrates Using Combined Deep-Learning and an Enhanced Thermal Network Model. IEEE Access 13: 107926-107935 (2025)

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