Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors."

Ji Heon Lee et al. (2021)

> Home

Details and statistics

DOI: 10.1109/ACCESS.2021.3108628

access: open

type: Journal Article

metadata version: 2021-09-16

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/access/LeeLCAKGC21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/access/LeeLCAKGC21
Ji Heon Lee, Young Seo Lee, Jeong Hwan Choi, Hussam Amrouch, Joonho Kong, Young-Ho Gong, Sung Woo Chung:
Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors. IEEE Access 9: 120715-120729 (2021)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.