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"Assembly Options and Challenges for Electronic Products With Lead-Free ..."

Chien-Ming Huang et al. (2020)

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DOI: 10.1109/ACCESS.2020.3010771

access: open

type: Journal Article

metadata version: 2021-10-04

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  - https://dblp.org/rec/journals/access/HuangROP20
Chien-Ming Huang, Anto Raj, Michael D. Osterman, Michael G. Pecht:
Assembly Options and Challenges for Electronic Products With Lead-Free Exemption. IEEE Access 8: 134194-134208 (2020)

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