"Health Condition Assessment of Base-Plate Solder for Multi-Chip IGBT ..."

Yaogang Hu et al. (2019)

> Home

Details and statistics

DOI: 10.1109/ACCESS.2019.2918029

access: open

type: Journal Article

metadata version: 2019-07-05

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/access/HuSLY19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/access/HuSLY19
Yaogang Hu, Pingping Shi, Hui Li, Chao Yang:
Health Condition Assessment of Base-Plate Solder for Multi-Chip IGBT Module in Wind Power Converter. IEEE Access 7: 72134-72142 (2019)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.