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"FEA Simulations for Thermal Distributions of Large Scale 3DIC Packages."

Suxia Chen et al. (2024)

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DOI: 10.1109/ACCESS.2024.3397616

access: open

type: Journal Article

metadata version: 2024-06-18

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  - https://dblp.org/rec/journals/access/ChenWXZX24
Suxia Chen, Qiang Wu, Wayne Xun, Jiachen Zhang, Jianping Xun:
FEA Simulations for Thermal Distributions of Large Scale 3DIC Packages. IEEE Access 12: 76837-76843 (2024)

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