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"TSV-Aware Analytical Placement for 3-D IC Designs Based on a Novel ..."

Meng-Kai Hsu, Valeriy Balabanov, Yao-Wen Chang (2013)

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DOI: 10.1109/TCAD.2012.2226584

access: closed

type: Journal Article

metadata version: 2020-09-24

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Meng-Kai Hsu, Valeriy Balabanov, Yao-Wen Chang:
TSV-Aware Analytical Placement for 3-D IC Designs Based on a Novel Weighted-Average Wirelength Model. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(4): 497-509 (2013)

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