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"Advancement in simulating moisture diffusion in electronic packages under ..."

Jing Wang et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.04.018

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jing Wang, Ruiyang Liu, Dapeng Liu, Seungbae Park:
Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions. Microelectron. Reliab. 73: 42-53 (2017)

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