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"Development of three-dimensional chip stacking technology using a clamped ..."
Li-Cheng Shen et al. (2010)
- Li-Cheng Shen, Chien-Wei Chien, Hsien-Chie Cheng, Chia-Te Lin:
Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection. Microelectron. Reliab. 50(4): 489-497 (2010)
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