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"The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu ..."

Sun-Kyoung Seo et al. (2009)

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DOI: 10.1016/J.MICROREL.2008.11.014

access: closed

type: Journal Article

metadata version: 2020-02-22

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Sun-Kyoung Seo, Sung K. Kang, Da-Yuan Shih, Hyuck Mo Lee:
The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging. Microelectron. Reliab. 49(3): 288-295 (2009)

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