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"Investigations of the influence of dicing techniques on the strength ..."

Stephan Schoenfelder et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.09.002

access: closed

type: Journal Article

metadata version: 2020-10-26

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  - https://dblp.org/rec/journals/mr/SchoenfelderELBB07
Stephan Schoenfelder, Matthias Ebert, Christof Landesberger, Karlheinz Bock, Jörg Bagdahn:
Investigations of the influence of dicing techniques on the strength properties of thin silicon. Microelectron. Reliab. 47(2-3): 168-178 (2007)

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