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"FSI implications of EMC rheological properties to 3D IC with TSV ..."

Ernest E. S. Ong et al. (2013)

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DOI: 10.1016/J.MICROREL.2012.10.015

access: closed

type: Journal Article

metadata version: 2022-05-21

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Ernest E. S. Ong, Mohd Zulkifly Abdullah, W. K. Loh, C. K. Ooi, R. Chan:
FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process. Microelectron. Reliab. 53(4): 600-611 (2013)

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