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"Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and ..."

Hsiu-Jen Lin, Tung-Han Chuang (2011)

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DOI: 10.1016/J.MICROREL.2010.07.061

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hsiu-Jen Lin, Tung-Han Chuang:
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish. Microelectron. Reliab. 51(2): 445-452 (2011)

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