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"Experimental determination of the Young's modulus of copper and solder ..."

Frank Kraemer et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.06.002

access: closed

type: Journal Article

metadata version: 2022-10-02

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Frank Kraemer, Mike Roellig, René Metasch, Joseph Al Ahmar, Karsten Meier, Steffen Wiese:
Experimental determination of the Young's modulus of copper and solder materials for electronic packaging. Microelectron. Reliab. 91: 251-256 (2018)

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