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"Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints."

Ming-Hwa R. Jen, Lee-Cheng Liu, Yi-Shao Lai (2009)

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DOI: 10.1016/J.MICROREL.2009.04.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Ming-Hwa R. Jen, Lee-Cheng Liu, Yi-Shao Lai:
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints. Microelectron. Reliab. 49(7): 734-745 (2009)

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