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"Modeling of copper wire bonding process on high power LEDs."

Zhaohui Chen, Yong Liu, Sheng Liu (2011)

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DOI: 10.1016/J.MICROREL.2010.03.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Zhaohui Chen, Yong Liu, Sheng Liu:
Modeling of copper wire bonding process on high power LEDs. Microelectron. Reliab. 51(1): 171-178 (2011)

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