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"On the crack and delamination risk optimization of a Si-interposer for LED ..."

Jürgen Auersperg et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.02.018

access: closed

type: Journal Article

metadata version: 2022-10-02

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Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka, Bernd Michel:
On the crack and delamination risk optimization of a Si-interposer for LED packaging. Microelectron. Reliab. 54(6-7): 1223-1227 (2014)

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