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"Optimization of the thermal reliability of a four-tier die-stacked SiP ..."

Yu Tang et al. (2018)

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DOI: 10.1016/J.MEJO.2018.01.011

access: closed

type: Journal Article

metadata version: 2023-03-28

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Yu Tang, Shaoming Luo, G. Y. Li, Z. Yang, Rui Chen, Y. Han, Chaojun Hou:
Optimization of the thermal reliability of a four-tier die-stacked SiP structure using finite element analysis and the Taguchi method. Microelectron. J. 73: 18-23 (2018)

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