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"Virtualized and fault-tolerant inter-layer-links for 3D-ICs."

Felix Miller, Thomas Wild, Andreas Herkersdorf (2013)

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DOI: 10.1016/J.MICPRO.2013.04.013

access: closed

type: Journal Article

metadata version: 2020-02-22

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Felix Miller, Thomas Wild, Andreas Herkersdorf:
Virtualized and fault-tolerant inter-layer-links for 3D-ICs. Microprocess. Microsystems 37(8-A): 823-835 (2013)

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