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"A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip ..."
Noriyuki Miura et al. (2007)
- Noriyuki Miura, Daisuke Mizoguchi, Mari Inoue, Kiichi Niitsu, Yoshihiro Nakagawa, Masamoto Tago, Muneo Fukaishi, Takayasu Sakurai, Tadahiro Kuroda:
A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link. IEEE J. Solid State Circuits 42(1): 111-122 (2007)
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