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"An Efficient Multi-Level Algorithm for 3D-IC TSV Assignment."

Cong Hao, Takeshi Yoshimura (2017)

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DOI: 10.1587/TRANSFUN.E100.A.776

access: closed

type: Journal Article

metadata version: 2020-04-11

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  dblp key:
  - journals/ieicet/HaoY17
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  persistent URL:
  - https://dblp.org/rec/journals/ieicet/HaoY17
Cong Hao, Takeshi Yoshimura:
An Efficient Multi-Level Algorithm for 3D-IC TSV Assignment. IEICE Trans. Fundam. Electron. Commun. Comput. Sci. 100-A(3): 776-784 (2017)

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