"High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and ..."

Manho Lee et al. (2016)

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DOI: 10.1109/MDAT.2015.2455336

access: closed

type: Journal Article

metadata version: 2020-03-13

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Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim:
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. IEEE Des. Test 33(2): 17-29 (2016)

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