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"Post-bond test techniques for TSVs with crosstalk faults in 3D ICs."

Yu-Jen Huang, Jin-Fu Li, Che-Wei Chou (2012)

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DOI: 10.1109/VLSI-DAT.2012.6212658

access: closed

type: Conference or Workshop Paper

metadata version: 2023-10-17

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Yu-Jen Huang, Jin-Fu Li, Che-Wei Chou:
Post-bond test techniques for TSVs with crosstalk faults in 3D ICs. VLSI-DAT 2012: 1-4

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