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"A 3D IC BIST for pre-bond test of TSVs using ring oscillators."
Yassine Fkih et al. (2013)
- Yassine Fkih, Pascal Vivet, Bruno Rouzeyre, Marie-Lise Flottes, Giorgio Di Natale:
A 3D IC BIST for pre-bond test of TSVs using ring oscillators. NEWCAS 2013: 1-4
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