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"On maximizing the compound yield for 3D Wafer-to-Wafer stacked ICs."

Mottaqiallah Taouil et al. (2010)

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DOI: 10.1109/TEST.2010.5699218

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

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  dblp key:
  - conf/itc/TaouilHVM10
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  - https://dblp.org/rec/conf/itc/TaouilHVM10
Mottaqiallah Taouil, Said Hamdioui, Jouke Verbree, Erik Jan Marinissen:
On maximizing the compound yield for 3D Wafer-to-Wafer stacked ICs. ITC 2010: 183-192

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