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"Thermal via allocation for 3D ICs considering temporally and spatially ..."

Hao Yu et al. (2006)

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DOI: 10.1145/1165573.1165611

access: closed

type: Conference or Workshop Paper

metadata version: 2022-12-13

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  dblp key:
  - conf/islped/YuSHK06
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Hao Yu, Yiyu Shi, Lei He, Tanay Karnik:
Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power. ISLPED 2006: 156-161

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