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"Performance analysis of through silicon via (TSV) and through glass via ..."

Abdul Hamid Bin Yousuf, Nahid M. Hossain, Masud H. Chowdhury (2015)

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DOI: 10.1109/ISCAS.2015.7169057

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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  dblp key:
  - conf/iscas/YousufHC15
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Abdul Hamid Bin Yousuf, Nahid M. Hossain, Masud H. Chowdhury:
Performance analysis of through silicon via (TSV) and through glass via (TGV) for different materials. ISCAS 2015: 1957-1960

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