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"CPI Reliability Challenges of Large Flip Chip Packages and Effects of Kerf ..."

Zhuo-Jie Wu et al. (2019)

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DOI: 10.1109/IRPS.2019.8720530

access: closed

type: Conference or Workshop Paper

metadata version: 2019-05-31

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  dblp key:
  - conf/irps/WuNCDQB19
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  - https://dblp.org/rec/conf/irps/WuNCDQB19
Zhuo-Jie Wu, Manish Nayini, Charles Carey, Samantha Donovan, David Questad, Edmund D. Blackshear:
CPI Reliability Challenges of Large Flip Chip Packages and Effects of Kerf Size and Substrate. IRPS 2019: 1-7

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