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"Effects of copper CMP and post clean process on VRDB and TDDB at 28nm and ..."

Li Chieh Hsu et al. (2015)

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DOI: 10.1109/IRPS.2015.7112775

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - conf/irps/HsuLWLLCHWHL15
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  - https://dblp.org/rec/conf/irps/HsuLWLLCHWHL15
Li Chieh Hsu, Yu-Min Lin, Chien Liang Wu, Wei Kun Lee, Yen Chun Liu, Cheng Pu Chiu, Hsin Kuo Hsu, Chun Yi Wang, Chien Chung Huang, Chin Fu Lin:
Effects of copper CMP and post clean process on VRDB and TDDB at 28nm and advanced technology node. IRPS 2015: 3

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