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"Combining fault tolerance and serialization effort to improve yield in 3D ..."

Anelise Kologeski et al. (2013)

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DOI: 10.1109/ICECS.2013.6815370

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-22

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  - conf/icecsys/KologeskiCMGMAK13
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  - https://dblp.org/rec/conf/icecsys/KologeskiCMGMAK13
Anelise Kologeski, Caroline Concatto, Debora Matos, Daniel Grehs, Tiago Motta, Felipe Almeida, Fernanda Lima Kastensmidt, Altamiro Amadeu Susin, Ricardo Reis:
Combining fault tolerance and serialization effort to improve yield in 3D Networks-on-Chip. ICECS 2013: 125-128

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