"Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs."

Jiwoo Pak, Sung Kyu Lim, David Z. Pan (2013)

Details and statistics

DOI: 10.1109/ICCAD.2013.6691146

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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