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"Redistribution layer routing for wafer-level integrated fan-out ..."

Ting-Chou Lin, Chia-Chih Chi, Yao-Wen Chang (2017)

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DOI: 10.1109/ICCAD.2017.8203827

access: closed

type: Conference or Workshop Paper

metadata version: 2018-04-09

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  dblp key:
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  persistent URL:
  - https://dblp.org/rec/conf/iccad/LinCC17
Ting-Chou Lin, Chia-Chih Chi, Yao-Wen Chang:
Redistribution layer routing for wafer-level integrated fan-out package-on-packages. ICCAD 2017: 561-568

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