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"Geometric approach to chip-scale TSV shield placement for the reduction of ..."

Caleb Serafy, Bing Shi, Ankur Srivastava (2013)

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DOI: 10.1145/2483028.2483109

access: closed

type: Conference or Workshop Paper

metadata version: 2021-11-18

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Caleb Serafy, Bing Shi, Ankur Srivastava:
Geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs. ACM Great Lakes Symposium on VLSI 2013: 275-280

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