"An effective analytical 3D placer in monolithic 3D IC designs."

Yande Jiang et al. (2015)

Details and statistics

DOI: 10.1109/ASICON.2015.7517146

access: closed

type: Conference or Workshop Paper

metadata version: 2023-02-10

a service of  Schloss Dagstuhl - Leibniz Center for Informatics