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"Fault detection and redundancy design for TSVs in 3D ICs."

Sai Hu et al. (2015)

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DOI: 10.1109/ASICON.2015.7517148

access: closed

type: Conference or Workshop Paper

metadata version: 2020-06-26

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  dblp key:
  - conf/asicon/HuW0XM15
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  - https://dblp.org/rec/conf/asicon/HuW0XM15
Sai Hu, Qin Wang, Zheng Guo, Jing Xie, Zhigang Mao:
Fault detection and redundancy design for TSVs in 3D ICs. ASICON 2015: 1-4

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