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"High density and reliable packaging technology with Non Conductive Film ..."

Kentaro Mori et al. (2013)

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DOI: 10.1109/3DIC.2013.6702322

access: closed

type: Conference or Workshop Paper

metadata version: 2020-07-01

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  - conf/3dic/MoriOWISIOMKHTK13
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  - https://dblp.org/rec/conf/3dic/MoriOWISIOMKHTK13
Kentaro Mori, Yoshihiro Ono, Shinji Watanabe, Toshikazu Ishikawa, Michiaki Sugiyama, Satoshi Imasu, Toshihiko Ochiai, Ryo Mori, Tsuyoshi Kida, Tomoaki Hashimoto, Hideki Tanaka, Michitaka Kimura:
High density and reliable packaging technology with Non Conductive Film for 3D/TSV. 3DIC 2013: 1-7

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