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"Surface passivation of Cu cone bump by self-assembled-monolayer for room ..."

Akihiro Ikeda et al. (2013)

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DOI: 10.1109/3DIC.2013.6702317

access: closed

type: Conference or Workshop Paper

metadata version: 2019-06-07

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  dblp key:
  - conf/3dic/IkedaQNA13
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Akihiro Ikeda, L. J. Qiu, K. Nakahara, Tanemasa Asano:
Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding. 3DIC 2013: 1-4

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