"Automatic model verification for semiconductor manufacturing simulation."

Boon-Ping Gan et al. (2013)

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DOI: 10.1109/WSC.2013.6721745

access: closed

type: Conference or Workshop Paper

metadata version: 2021-06-10

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  - https://dblp.org/rec/conf/wsc/GanLSMP13
Boon-Ping Gan, Peter Lendermann, Wolfgang Scholl, Marcin Mosinski, Patrick Preuss:
Automatic model verification for semiconductor manufacturing simulation. WSC 2013: 3858-3865

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