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"Automated solder joint inspection system using optical 3-D image detection."

Yukio Matsuyama et al. (1996)

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DOI: 10.1109/ACV.1996.572014

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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  dblp key:
  - conf/wacv/MatsuyamaHYSNNSLKSMS96
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  persistent URL:
  - https://dblp.org/rec/conf/wacv/MatsuyamaHYSNNSLKSMS96
Yukio Matsuyama, Toshifumi Honda, Hisae Yamamura, Hideaki Sasazawa, Mineo Nomoto, Takanori Ninomiya, Anton Schick, Ludwig Listl, Paul Köllensperger, Dieter Spriegel, Peter Mengel, Richard Schneider:
Automated solder joint inspection system using optical 3-D image detection. WACV 1996: 116-122

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