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"8-Layer 3D Vertical Ru/AlOxNy/TiN RRAM with Mega-Ω Level LRS for Low ..."

Shengjun Qin et al. (2022)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46769.2022.9830164

access: closed

type: Conference or Workshop Paper

metadata version: 2022-08-05

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Shengjun Qin, Maryann C. Tung, Emma Belliveau, Shuhan Liu, Jimin Kwon, Wei-Chen Chen, Zizhen Jiang, S. Simon Wong, H.-S. Philip Wong:
8-Layer 3D Vertical Ru/AlOxNy/TiN RRAM with Mega-Ω Level LRS for Low Power and Ultrahigh-density Memory. VLSI Technology and Circuits 2022: 314-315

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