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"Co-optimization of fault tolerance, wirelength and temperature mitigation ..."

Yi Zhao et al. (2016)

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DOI: 10.1109/VLSI-SOC.2016.7753572

access: closed

type: Conference or Workshop Paper

metadata version: 2019-08-02

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Yi Zhao, S. Saqib Khursheed, Bashir M. Al-Hashimi, Zhiwen Zhao:
Co-optimization of fault tolerance, wirelength and temperature mitigation in TSV-based 3D ICs. VLSI-SoC 2016: 1-6

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