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"Design and feasibility of multi-Gb/s quasi-serial vertical interconnects ..."
Fengda Sun et al. (2010)
- Fengda Sun, Alessandro Cevrero, Panagiotis Athanasopoulos, Yusuf Leblebici:
Design and feasibility of multi-Gb/s quasi-serial vertical interconnects based on TSVs for 3D ICs. VLSI-SoC 2010: 149-154
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