"Holistic and In-Context Design Flow for 2.5D Chiplet-Package Interaction ..."

M. D. Arafat Kabir et al. (2021)

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DOI: 10.1109/VLSI-DAT52063.2021.9427353

access: closed

type: Conference or Workshop Paper

metadata version: 2022-12-07

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M. D. Arafat Kabir, Weishiun Hung, Tsung-Yi Ho, Yarui Peng:
Holistic and In-Context Design Flow for 2.5D Chiplet-Package Interaction Co-Optimization. VLSI-DAT 2021: 1-4

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