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"Post-bond test techniques for TSVs with crosstalk faults in 3D ICs."
Yu-Jen Huang, Jin-Fu Li, Che-Wei Chou (2012)
- Yu-Jen Huang, Jin-Fu Li, Che-Wei Chou:
Post-bond test techniques for TSVs with crosstalk faults in 3D ICs. VLSI-DAT 2012: 1-4
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