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"P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs."

Dima Al Saleh et al. (2023)

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DOI: 10.1109/SOCC58585.2023.10256905

access: closed

type: Conference or Workshop Paper

metadata version: 2023-10-01

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  dblp key:
  - conf/socc/SalehSAV23
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  - https://dblp.org/rec/conf/socc/SalehSAV23
Dima Al Saleh, Yousef Safari, Fahad Rahman Amik, Boris Vaisband:
P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs. SOCC 2023: 1-6

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