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"Handling of multi-reflections in wafer bump 3D reconstruction."

Jun Cheng et al. (2008)

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DOI: 10.1109/ICSMC.2008.4811508

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Jun Cheng, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung:
Handling of multi-reflections in wafer bump 3D reconstruction. SMC 2008: 1558-1561

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