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"Hardware-in-the-Loop Evaluation of Grid-Edge DER Chip Integration Into ..."

Joshua Comden et al. (2023)

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DOI: 10.1109/SMARTGRIDCOMM57358.2023.10333873

access: closed

type: Conference or Workshop Paper

metadata version: 2024-01-03

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Joshua Comden, Jing Wang, Subhankar Ganguly, Steven Forsyth, Reynaldo Gomez, Andrey Bernstein:
Hardware-in-the-Loop Evaluation of Grid-Edge DER Chip Integration Into Next-Generation Smart Meters. SmartGridComm 2023: 1-6

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